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Tschudin AG

Suisse Technology Partners Ltd.
RhyTech Areal
Badische Bahnhofstrasse 16
CH-8212 Neuhausen am Rheinfall

Phone  +41 52 674 9521
Fax       +41 52 674 9222

www.suisse-tp.ch
info(at)suisse-tp.ch

Contact persons:
 Patrik Bachmann (Chemical Analytics) / Christian Breyer (Polymer Analytics)

Lab for Metal-, Trace-, Elementary Analytics and Polymer Analytics

Together with our customers, we find the most meaningful and cost effective investigation method for the specific analytical question. In many cases, the high content of information of a semi-quantitative scan analysis by ICP-OES / ICP-MS or XRF is sufficient for the customer.

Our lab is specialized for chemical and physical analytical testing such as:

  • Trace analysis for metals in organic samples according to Ph.Eur and USP
  • Analysis of metals (alloy composition, trace elements and surface testing by XPS)
  • Corrosion- and failure analysis
  • Scan analysis of inorganic samples by X-ray fluorescence (XRF)
  • Testing and characterization of polymers, composites and polymer additives
  • Computer tomography and electron scanning microscopy
  • Method development and validation
  • Consulting and analytical services for development projects
  • Material testing

Our major analytical techniques for chemical testing are ICP-MS, ICP-OES, AAS, UV-VIS, XRF, XPS, gravimetry and titration. For polymer testing we have methods such as FTIR, DSC, TGA, DMA, TMA, rheology as well as calorimetry and coulometry. 

For physical analytical testing, the major technologies are light microscopy, scanning electron microscopy (SEM) with EDX and EBSD, electron probe micro analysis, interference microscopy, computer tomography and instrumented micro hardness testing.

Our lab is accredited according to ISO 17025 and is GMP-certified.

At Suisse Technology Partners, specialists for numerical simulation are available for specific questions such as behavior prediction of construction material and optimization of packaging material (e.g. diffusion of humidity in pharmaceutical blisters or thermal impact during sealing process).

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